Typ
Artikel in einem Journal
Gebiet
Detektorentwicklung
Autor
T. Poikela, …, C. Brezina, K. Desch, Y. Fu, A. Kruth et al
Titel
TWEPP 2013: Digital column readout architectures for hybrid pixel detector readout chips
Datum
2014-01
Reportnummer
2014 JINST 9 C01007
Kurzfassung
In this paper, two digital column architectures suitable for sparse readout of data from a pixel matrix in trigger-less applications are presented. Each architecture reads out a pixel matrix of 256 x 256 pixels with a pixel pitch of 55 μm. The first architecture has been implemented in the Timepix3 chip, and this is presented together with initial measurements. Simulation results and measured data are compared. The second architecture has been designed for Velopix, a readout chip planned for the LHCb VELO upgrade. Unlike Timepix3, this has to be tolerant to radiation-induced single-event effects. Results from post-layout simulations are shown with the circuit architectures.
Journal
doi:10.1088/1748-0221/9/01/C01007